Set of SIM Card Manufacturing Equipment

206.000

Description

Glue Tape Lamination System CML 200

Basic CML 200 incl.

  • Integrated Spooler System Input
  • Glue Tape Punching Station
  • Lamination Station
  • Integrated Spooler System Output

Technical Data

  • Module tape 35mm/super35mm
  • Module pitch 9.5 14.25 mm
  • Throughput
    up to 6,000 uph (8-contact module tape)
    up to 9,000 uph (6-contact module tape) in case of pressing process time of 1,500 ms

 

Combined Milling and Implanting System CMI 201

CMI 201 consisting of:

  • CH 200/I
  • CNC Milling Head
  • Cleaning Station
  • Cavity Depth Measurement
  • Implanting / Prefixing Station
  • Hot Press Station
  • Cold Press Station
  • Electrical Test Station
  • Automatic Reject Discharge
  • CH 200/O Card Output Device

Technical Data

  • Card types ID-1 cards PC, PVC, ABS, PET, TeCoLas®
  • 1 CNC milling head
  • Programmable milling axis 3 (x-, y-, z-axis)
  • Dynamic drive accuracy x- / y-axis: +/- 15 μ z-axis: +/- 10 μ
  • Measurement system accuracy +/- 2.5 μ.
  • Implanting accuracy / pressure x, y = +/- 30 μ / up to 200 N
  • Implanting pressure temperature Up to 200 N / up to 300°C
  • Throughput Up to 2,500 uph depending on material

 

GSM 6000 Personalization System Combi Coding and Laser Engraving

GSM 6000 consisting of:

  • Card Input Buffer 8-fold
  • Process Unit Chip Encoding
  • Contacted Chip Encoding 32-fold
  • Basic Laser Engraving Fiber Laser LES 30 F with Exhaust System
  • Card Output Buffer 8-fold
  • MCES – MB Perso Platform with GSM Encoding Application

Technical Data

  • Card format / materials ID-1 cards / PC, PVC, ABS, PET, PETG, TeCoLas®
  • IC Module types Processor modules: T=0 / T=1
  • Memory modules I2C bus / 23-wire
  • Interface Ethernet
  • Throughput Up to 6,000 cards / hour depending on process

Additional information

Availability

Year of manufacturing

Current condition

Sold in 2016

Sold in 2016