Description
Glue Tape Lamination CML 200
- Suitable for a wide range of IC module tapes (standard as well as Dual Interface).
- Integrated automatic spooling for input and output
- Lamination Tool Set M3
- Pressure Time 0-10 sec ± 0,1 sec
- Pressure Up to 300 N/cm2, 6 ± 0 3 bar
- Temperature Up to 180oC ± 5 %
- THROUGHPUT Up to 7000 Modules/hour
2 units Combined Milling & Implanting CMI 200+
- Combined milling implanting system for standard ID-1 smart card applications
- Card input and Output device CH200/I and CH200/O
- CNC Milling head
- Stations Cavity measurement, cleaning, implanting, pre fixing, hot press, cold, ATRMB 1024 – Chip encode Hardware
- Tools set M3
- Implanting Pressure Up to 200 N
- Implanting Temperature Up to 250oC ± 4
- Implanting Up to 4 sec ± 1 sec
- THROUGHPUT Up to 2500 Card/hour
Plug punching CMP 200
- Plug punching system for all SIM shapes
- Automatic magazine changer
- Punching System Hydropneumatic driven
- Cutting /Stamping Unit Hydropneumatic driven
- Accuracy ± 0 1mm
- MG 500/TB Magazines 4 pieces
- THROUGHPUT Up to 3000 Cards/hour
High Speed Personalization SCP 5700
- Card input and Output device CH4011/I andCH4012/O
- Double Card Recognition
- Extension of chip encoding module 32 stations
- Laser engraving Basis XM 1050/LL and Laser PL 20E with card centering and exhaust system
- Open universal personalization management system
- Automatic reject discharge
- MG 500/TB Magazines 4 pieces
- THROUGHPUT Up to 3000 Cards/hour
