Description
Configuration
- Card input
- Card orientation and thickness measurement
- 1x Milling Station
- Cavity Cleaning
- Cavity Measurement
- Resonance Frequency check after milling
- Tacking Station
- 2x Welding Station
- Cooling Station incl. Module measurement
- Resonance Frequency check after embedding
- Electrical test (ATR) and reject station
- Card output
- 5 Station chip encoder which was never used, so function cannot be guaranteed
- Modul punching and welding station tools on request.