Description
Glue Tape Lamination System CML 200
Basic CML 200 incl.
- Integrated Spooler System Input
- Glue Tape Punching Station
- Lamination Station
- Integrated Spooler System Output
Technical Data
- Module tape 35mm/super35mm
- Module pitch 9.5 14.25 mm
- Throughput
up to 6,000 uph (8-contact module tape)
up to 9,000 uph (6-contact module tape) in case of pressing process time of 1,500 ms
Combined Milling and Implanting System CMI 201
CMI 201 consisting of:
- CH 200/I
- CNC Milling Head
- Cleaning Station
- Cavity Depth Measurement
- Implanting / Prefixing Station
- Hot Press Station
- Cold Press Station
- Electrical Test Station
- Automatic Reject Discharge
- CH 200/O Card Output Device
Technical Data
- Card types ID-1 cards PC, PVC, ABS, PET, TeCoLas®
- 1 CNC milling head
- Programmable milling axis 3 (x-, y-, z-axis)
- Dynamic drive accuracy x- / y-axis: +/- 15 μ z-axis: +/- 10 μ
- Measurement system accuracy +/- 2.5 μ.
- Implanting accuracy / pressure x, y = +/- 30 μ / up to 200 N
- Implanting pressure temperature Up to 200 N / up to 300°C
- Throughput Up to 2,500 uph depending on material
GSM 6000 Personalization System Combi Coding and Laser Engraving
GSM 6000 consisting of:
- Card Input Buffer 8-fold
- Process Unit Chip Encoding
- Contacted Chip Encoding 32-fold
- Basic Laser Engraving Fiber Laser LES 30 F with Exhaust System
- Card Output Buffer 8-fold
- MCES – MB Perso Platform with GSM Encoding Application
Technical Data
- Card format / materials ID-1 cards / PC, PVC, ABS, PET, PETG, TeCoLas®
- IC Module types Processor modules: T=0 / T=1
- Memory modules I2C bus / 23-wire
- Interface Ethernet
- Throughput Up to 6,000 cards / hour depending on process
